BQC 23rd Anniversary Celebration
Jul 24, 2026
November 26, 2025 – The global printed circuit board assembly (PCBA) industry is undergoing a profound transformation in 2025, fueled by surging demand from artificial intellige...
As we move into an increasingly digital and interconnected world, innovations in PCBA technology are playing a pivotal role in shaping the future of electronics. This article wi...
Announcement on Commendation of the Third Quarter Innovation Awards To continuously inspire the innovative enthusiasm of all employees and encourage active contributions to the ...
Q3 2025 Innovation Award Results Released - Driving Innovation and Supporting High-Quality Development To continuously promote technological upgrades, process optimization, and ...
Reliability Analysis of Lead-Free Soldering Process With the growing demand for environmentally friendly electronics, lead-free soldering has become a standard in PCB assembly, ...
Thermal Design Methods for Miniaturized PCBAs As electronic devices become increasingly compact and high-performing, miniaturized PCB assemblies (PCBAs) face significant thermal...
In the modern electronics industry, environmental protection and material safety have become critical considerations. The REACH Regulation—short for Registration, Evaluation, Au...
What is DIP? Introduction Dual In-line Package (DIP) is a classic through-hole technology (THT) for mounting electronic components on printed circuit boards (PCBs). Characterize...
What is SMT? Introduction Surface Mount Technology (SMT) is the modern method of constructing electronic circuits where components are mounted directly onto the surface of a Pri...
