Following the cross-functional SST process training held earlier this month, BQC has finished commissioning four dedicated process devices, turning unified SST manufacturing standards into stable mass production hardware capacity.
The training session sorted out the full workflow requirements of SST PCBA, while the newly introduced equipment solves key technical pain points in power board production. Selective wave soldering stabilizes through-hole joint quality for high-thickness copper substrates; press fit technology avoids thermal damage to power chips during welding; water-based cleaning reduces long-term corrosion risks caused by residual pollutants; high-speed optical measuring ensures consistent dimensional precision of press-fit structures. All equipment matches the testing checkpoints and quality control protocols defined in the SST training.
With standardized process specifications and supporting professional equipment fully aligned, BQC has formed a mature hardware & process system for high-reliability power electronics production. We are fully prepared to undertake customized SST, new energy and industrial power PCBA projects for global partners.
