Recently, BQC has completed installation, debugging and mass production verification of four core specialized manufacturing equipment, further boosting our full-process PCBA manufacturing capability tailored for SST solid-state transformer and high-end power electronics applications.
Our engineering team has fully validated the performance of selective wave solder machine, CT1050L press fit machine, water-based cleaning system and optical quick measuring instrument. The selective wave soldering equipment delivers stable soldering for thick copper PCBs and complex hard-to-solder components, fully compliant with IPC standards. The press fit machine supports solder-free precision assembly for IGBT, SiC power modules and large-current connectors. The water-based cleaning unit eliminates ion contamination and flux residues to meet ultra-high cleanliness requirements, while the optical measuring device realizes fast full inspection of press-fit hole dimensions.
The completion of new equipment deployment creates a complete closed-loop production chain covering soldering, power component assembly, board cleaning and precision quality testing. This hardware upgrade enables BQC to provide more reliable one-stop PCBA solutions for global power electronics clients, allowing customers to quickly verify our upgraded process strength and accelerate project order cooperation.
