Rising material costs are again rippling through the global printed circuit board (PCB) supply chain as strong AI-driven demand collides with tight upstream capacity.
Industry sources report that laminate makers have issued repeated price-adjustment notices through 2026. In the latest round, thin-glass prepreg (PP) and thin-core laminates were raised by 15%, marking the eighth increase from a major producer this year. Certain multilayer CCL grades are also scheduled to climb as much as 200% starting in early 2027, underscoring how deeply the shortage has cut into core materials.
Analysts trace the root cause to a structural supply gap in high-end electronic glass fiber, the key reinforcement base for copper-clad laminates. Unlike standard production lines, high-end e-glass fiber requires purpose-built looms, new plants, and long capacity-ramp cycles, leaving supply rigid in the near term. As AI servers, high-speed switches, and other computing infrastructure absorb more high-layer and high-frequency boards, demand for premium fiber keeps outstripping what producers can add.
The effect is spreading downstream. PCB manufacturers with strong access to materials and efficient cost management are better placed to buffer the increases, while players dependent on spot markets face steeper pressure on margins. For now, the industry expects elevated prices to persist until new high-end capacity comes online in the coming years.
