BQC recently organized an internal workshop dedicated to reliability testing for SST PCBA assemblies, targeting key challenges in high-voltage, high-power electronics applications.
The workshop covered critical testing stages including ICT, low-voltage and end-of-line FCT, high-voltage power testing, and burn-in validation. Attendees reviewed our in-house developed ATE systems, which support full functional verification, quick root-cause analysis, and continuous process improvement. The team also discussed cleanliness standards and ion contamination control to prevent long-term performance degradation in harsh operating environments.
This activity strengthened the team's expertise in SST-specific reliability requirements, further enhancing BQC's ability to deliver robust, quality-assured PCBA products to power electronics clients worldwide.
