This procedure is to accurately mount the components to the corresponding position on the PCB surface printed with solder paste or chip adhesive by using the mounting machine or manually.
Machine mounting features large batch and tight supply cycle; It is suitable for mass production, with complex working procedures and large investment.
Manual mounting is applicable to small and medium-sized batch production and product R & D. The operation is simple and the cost is low, but the production efficiency is determined by the proficiency of the operators. Main tools for manual mounting: vacuum suction pen, tweezers, IC suction and release aligner, low power stereomicroscope or magnifying glass, etc
