Apply Solder Paste
The purpose is to evenly apply an appropriate amount of solder paste to the solder pad of PCB, so as to ensure that the solder pad corresponding to the chip components and PCB can achieve good electrical connection and have sufficient mechanical strength during reflow soldering.
Solder paste is a paste with certain viscosity and good touch characteristics, which is composed of alloy powder, paste flux and some additives. At room temperature, because the solder paste has certain viscosity, electronic components can be pasted on the PCB pad. Under the condition that the inclination angle is not too large and there is no external force collision, the general components will not move. When the solder paste is heated to a certain temperature, the alloy powder in the solder paste melts and flows again, and the liquid solder soaks the component's solder end and PCB pad. After cooling, the component's solder end and pad are interconnected by solder, Form a welding joint for electrical and mechanical connection.
