BQC factory environment
FAQ
Q1: What does your company do for product testing?
A1:We have SPI+AOI and X-Ray and ICT as well as FCT testing.
Q2: What are the advantages of your company's OEM service?
A2:Our product costs are gradually reduced and our project are increasingly optimized.
Company Knowledge
PCB flexible circuit board welding method operation
1. Before soldering, apply flux on the pad and treat it with a soldering iron to avoid poor tin plating or oxidation of the pad, resulting in poor soldering, and the chip generally does not need to be processed.
2. Carefully place the PQFP chip on the PCB with tweezers, taking care not to damage the pins. Align it with the pads, making sure the chip is placed in the correct orientation. Adjust the temperature of the soldering iron to more than 300 degrees Celsius, dip a small amount of solder on the tip of the soldering iron, press down on the chip that has been aligned with the tool, and add a small amount of flux to the pins at the two opposite corners. Hold the chip down and solder the pins on two opposite corners so that the chip is fixed and cannot be moved. Recheck the alignment of the chip after soldering the diagonal corners. Adjust if necessary or remove and realign on the PCB.
3. When starting to solder all pins, add solder to the tip of the soldering iron and apply flux to all pins to keep the pins wet. Touch the end of each pin of the chip with the tip of the soldering iron until you see solder flowing into the pin. When soldering, keep the tip of the soldering iron parallel to the pins to be soldered to prevent overlapping due to excess solder.
4. After soldering all the pins, wet all the pins with flux to clean the solder. Absorb excess solder where needed to eliminate any shorts and laps. Finally, use tweezers to check whether there is any virtual soldering. After the inspection is completed, remove the flux from the circuit board, dip a stiff brush in alcohol and wipe it carefully along the direction of the pins until the flux disappears.
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