Showcase of our products
Factory capacity of BQC
Our production capacity: 16 SMT processing lines, 4 plug-in lines, 4 post welding lines.
Main equipment: automatic loading machine 12 sets; 12 automatic solder paste printing machines; SPI solder paste automatic detector 4 sets; 25 SMT machines; Reflux welding furnace 6; The first piece of detector 2 sets; AOI detector 12 sets (Shenzhou ALD515 11 sets, Zhenhuaxing A410 2 sets); 1 X-RAY8200 testing machine; 1 steel mesh cleaning machine; 2 ovens; 1 PCBA splitter; One BGA repair station and so on.
Development history of BQC
In January 2004, it was officially established in Longhua Sakata, Shenzhen.
In 2007, the laser level control board products were successfully developed, and the company expanded its scale and moved to Guangming District, Shenzhen.
In 2015, ODM project electric comb was successfully developed and mass-produced; ISO13485:2016 Quality system certification audit passed.
In 2022，BMS related yield: 14GWh+.
BQC actual process capability
- Number of substrate layers: 1~16 layers; Substrate: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum substrate
- Substrate thickness: 0.2~7.0mm; Maximum size of the substrate: 500mm x 500mm
- Copper thickness: 0.5~4.0oz; Patch accuracy: laser recognition ±0.05mm, image recognition ±0.03mm
- Component height: 6mm (Max); Pin spacing: laser recognition 0.65mm; High resolution VCS 0.2mm
- Spherical spacing: laser recognition 1.0mm; High resolution VCS 0.25mm
- BGA spherical distance: ≥0.25mm; BGA ball center distance: ≥0.25mm; BGA ball diameter: ≥0.1mm; IC foot distance: ≥ 0.2mm
Our strength
We can help customers reduce prices by 10-30% while maintaining or improving quality
We can help customers significantly reduce delivery times by substituting materials with shorter delivery times
At the same time, we will stock the goods in advance according to the customer's order prediction
We have ODM team technical support, can help customers to improve the design of the product
Quality control
After the template is made, problems will be found in materials, PCBlayout, production process and testing, and improvement countermeasures will be proposed, and customers will be reminded to improve.
After each batch of mass production, problems will be found in materials, PCBlayout, production process, and testing, and improvement countermeasures will be proposed, and hidden dangers of quality will be excavated, and improvement countermeasures will be proposed.
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