The specific information when the PCBA fails, some of which have failed in the pre-processing such as welding and assembly process, such as poor solderability, delamination, etc.; ECM, burning board, etc.; need to understand the failure process and related parameters in detail.
BQC believes that the analysis of failed products must follow the principle of layer-by-layer analysis from the outside to the inside, from non-destructive to damaged. Appearance observation is the first step in the analysis of failed products. Through the appearance of the failure site and combined with background information, experienced The engineers of our company can basically judge several possible reasons for the failure, and conduct follow-up analysis in a targeted manner.
