What issues should I be aware of with the wave soldering process?
Wave soldering is a batch soldering process used to manufacture PCBs. The basic equipment used in the process is a conveyor to move the PCB through different areas, a solder tray used in the soldering process, a pump to produce the actual waves, a sprayer for the solder and a preheating pad. The solder is usually a mixture of metals. Wave soldering is mainly used for soldering through-hole components.
What issues need attention in the wave soldering process?
1. Green oil in the component holes leads to poor tinning of the holes. The green oil in the hole should not exceed 10% of the hole wall, and the number of holes with internal green oil should not exceed 5%.
2, the thickness of the coating is not enough, resulting in poor tin plating in the hole.
3, the thickness of the coating on the component hole wall is not enough, leading to bad tin plating in the hole. For example, the thickness of copper, tin thickness, gold thickness, etc. Usually, the thickness of the hole wall should be greater than 18μm.
4, the hole wall is too rough, leading to poor tin plating or pseudo-soldering in the hole. If the hole wall is too rough, the plating will be uneven; some coatings are too thin, which will affect the effect of tinning.
5. Holes that are wet, leading to pseudo-soldering or bubbles. Encapsulating PCBs when they are not dry or cool, and leaving them for a long time after unpacking, etc., lead to damp holes and pseudo-soldering or bubbles.
6. The size of the pad is too small, leading to poor soldering.
7、The inside of the hole is dirty, leading to poor soldering. inadequate cleaning of the PCB, such as gold plates without pickling, leads to impurities and dirt residues on the hole and pad, affecting the tin effect.
8、Solder failure due to hole size being too small to insert the part into the hole.
9、Parts cannot be inserted into the holes due to offset positioning holes, resulting in soldering failure.
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