SMT Mother Printed Circuit Board Intergrated PCB PCBA Electric Assembly of EMS Ecm Service

With our faith, we are to make the PCBA FINAL PRODUCT DESIGN, Aluminum LED Light PCB Assembly Manufacturing Services, Full Range Pcba Smt Service high efficient. We are willing to establish and develop economic and trade cooperation with friends from all walks of life, seek common development, and work hard for a better future. Hope to get inquiries type you and construct a long-term co-operation partnership. For us, progress never stops. In cooperation with you, we will continue to propose new solutions, so that your ideas and our technical suggestions can be constantly turned into reality, so as to benefit you.

Our service scope:

Processing of incoming materials:

SMT patch, DIP plug-in, post welding, test maintenance, assembly, three-proof paint spray, 10,000-level dust-free LCD assembly, SMT 4-6 hours fast proofing.

What about our capitity

For OEM:

Printed circuit board manufacturing (PCB manufacturing), procurement of components and related structural parts, accessories, PCBA quick proofing, electronic contract manufacturing, PCBA patch processing (SMT), PCBA through-hole plug-in processing (THT), DIP processing (wire assembly / Structural parts assembly / three anti-paint spray), post-welding, multi-layer high-precision electronic products manufacturing.

ODM:

One, fully contracted

Client: only idea

BQC: Responsible for software development, hardware development (production schematics / PCB LAYOUT / component selection), structural design, process planning optimization, product certification.

The semi-contracting model

BQC only helps customers design in one or several of the following areas: software, hardware, structure, component selection or replacement, DFM, process planning and optimization, process automation, and automated test equipment design.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

We persevere in the development of technological innovation, integrate the most advanced technology into our product production, and strive to create perfect SMT Mother Printed Circuit Board Intergrated PCB PCBA Electric Assembly of EMS Ecm Service. We promote the professional development of skilled personnel with the core of improving vocational quality and professional skills. The rationalization of management is the root of creating business performance, while profit is the result of business performance.