Shenzhen Manufacturer PCBA (SMT, DIP, OEM, EMS Board) Assembly

We have completed the re-adjustment of the entire product system and operation system to better provide quality Automotive Electronic Pcba Assembly, Medical Electronic Pcba Assembly, Electronic Pcba Prototype Assembly and services. We actively use the standard to seize the commanding height and win market recognition and customer trust. We sincerely welcome domestic and foreign merchants who calls, letters asking, or to plants to negotiate, we will offer you quality products and the most enthusiastic service, We look forward to your visit and your cooperation. We implement a branded market strategy with the tenet of 'leading technology, pragmatic innovation, and thoughtful service'. And with a complete marketing system and reliable quality, our products have a very high market share, and they are also widely recognized by many users.

Our service scope:

Processing of incoming materials:

SMT patch, DIP plug-in, post welding, test maintenance, assembly, three-proof paint spray, 10,000-level dust-free LCD assembly, SMT 4-6 hours fast proofing.

What about our capitity

For OEM:

Printed circuit board manufacturing (PCB manufacturing), procurement of components and related structural parts, accessories, PCBA quick proofing, electronic contract manufacturing, PCBA patch processing (SMT), PCBA through-hole plug-in processing (THT), DIP processing (wire assembly / Structural parts assembly / three anti-paint spray), post-welding, multi-layer high-precision electronic products manufacturing.

ODM:

One, fully contracted

Client: only idea

BQC: Responsible for software development, hardware development (production schematics / PCB LAYOUT / component selection), structural design, process planning optimization, product certification.

The semi-contracting model

BQC only helps customers design in one or several of the following areas: software, hardware, structure, component selection or replacement, DFM, process planning and optimization, process automation, and automated test equipment design.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

We are constantly working hard to build our Shenzhen Manufacturer PCBA (SMT, DIP, OEM, EMS Board) Assembly into the most influential and most competitive brand. Your satisfaction is our unswerving work goal. Over the past few years, we have constantly adjusted and improved equipment and technology to make our products perfect and better serve every customer.