We're going to dedicate ourselves to offering our esteemed shoppers with the most enthusiastically considerate solutions for PCB, Electronic Smt Thru-hole Pcb Assembly, PCB Assembly Industrial Box Controller. You should find our web page to check additional info from our products. We will continue to adjust flexibly with the changes in the market environment, actively develop and produce new products, constantly improve the management mechanism, adhere to the "customer first, forge ahead" business philosophy. Our new type of marketing pays more attention to maintaining long-term and good family relationship with customers. Our company adheres to the production and management concept of 'value comes from quality, development only depends on innovation'.
Our service scope:
Processing of incoming materials:
SMT patch, DIP plug-in, post welding, test maintenance, assembly, three-proof paint spray, 10,000-level dust-free LCD assembly, SMT 4-6 hours fast proofing.
What about our capitity
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For OEM:
Printed circuit board manufacturing (PCB manufacturing), procurement of components and related structural parts, accessories, PCBA quick proofing, electronic contract manufacturing, PCBA patch processing (SMT), PCBA through-hole plug-in processing (THT), DIP processing (wire assembly / Structural parts assembly / three anti-paint spray), post-welding, multi-layer high-precision electronic products manufacturing.
ODM:
One, fully contracted
Client: only idea
BQC: Responsible for software development, hardware development (production schematics / PCB LAYOUT / component selection), structural design, process planning optimization, product certification.
The semi-contracting model
BQC only helps customers design in one or several of the following areas: software, hardware, structure, component selection or replacement, DFM, process planning and optimization, process automation, and automated test equipment design.
From processing ability of manufacturing
Our machine can mount the minimal components package size is 01005.
We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.
We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.
We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

From processing ability of manufacturing
Our machine can mount the minimal components package size is 01005.
We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.
We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.
We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

We will continue to uphold the spirit of innovation, focus on industry applications, and provide better Professional High Quality PCB and PCB Assembly for EMS Solution and services for the global industry, and create value for customers. Accurate quality, strict delivery and perfect service are our promise. Our advantages are professional and meticulous, integrity and thoughtful, based on customer satisfaction and long-term silent accumulation for the development of the industry, we gradually establish a sound after-sales service system.
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