OEM/ODM PCB /PCBA Board PCB Assembly Service EMS Service

Under the leadership of the company's leaders, we have introduced a large number of talents and established a complete quality management system to ensure the quality of our Pcb Pcba Service, Quick-turn Prototype For Smart watering devices, Printed Circuit Board Assembly Medical. We take marketing and service as the leading factor, through product trade to drive smart services, and smart services to reverse the trade model to achieve a two-way win-win situation. We will always maintain the courage and boldness to be the first in the world, always stand on the tide of the times, grow in learning and develop in innovation.

Our service scope:

Processing of incoming materials:

SMT patch, DIP plug-in, post welding, test maintenance, assembly, three-proof paint spray, 10,000-level dust-free LCD assembly, SMT 4-6 hours fast proofing.

What about our capitity

For OEM:

Printed circuit board manufacturing (PCB manufacturing), procurement of components and related structural parts, accessories, PCBA quick proofing, electronic contract manufacturing, PCBA patch processing (SMT), PCBA through-hole plug-in processing (THT), DIP processing (wire assembly / Structural parts assembly / three anti-paint spray), post-welding, multi-layer high-precision electronic products manufacturing.

ODM:

One, fully contracted

Client: only idea

BQC: Responsible for software development, hardware development (production schematics / PCB LAYOUT / component selection), structural design, process planning optimization, product certification.

The semi-contracting model

BQC only helps customers design in one or several of the following areas: software, hardware, structure, component selection or replacement, DFM, process planning and optimization, process automation, and automated test equipment design.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

As a large company with many years of experience, we develop OEM/ODM PCB /PCBA Board PCB Assembly Service EMS Service with independent intellectual property rights, which has great social and economic benefits. We always firmly believe that actively fulfilling social responsibility is not only the bounden duty of enterprises, but also the inherent requirement of sustainable development of enterprises. We hope to build a stable workforce and harmonious labor relations to enhance corporate cohesion.