Medical Instruments Equipments PCBA Electronics Components Assembly D

We are committed to improving product quality, developing and updating products in order to continuously provide customers with quality ISO9001 Turnkey PCB Assembly, Quick-turn Prototype For VR Glasses, Electronic PCBA Assembly and comprehensive services. Our company has independent import and export rights, professional foreign language personnel keep close contact with foreign countries, timely solve problems for customers. We will satisfy you with our professional service! In the future, we will continue to spare no effort to provide our customers with reliable products and services, and contribute to the development of the industry.

Our service scope:

Processing of incoming materials:

SMT patch, DIP plug-in, post welding, test maintenance, assembly, three-proof paint spray, 10,000-level dust-free LCD assembly, SMT 4-6 hours fast proofing.

What about our capitity

For OEM:

Printed circuit board manufacturing (PCB manufacturing), procurement of components and related structural parts, accessories, PCBA quick proofing, electronic contract manufacturing, PCBA patch processing (SMT), PCBA through-hole plug-in processing (THT), DIP processing (wire assembly / Structural parts assembly / three anti-paint spray), post-welding, multi-layer high-precision electronic products manufacturing.

ODM:

One, fully contracted

Client: only idea

BQC: Responsible for software development, hardware development (production schematics / PCB LAYOUT / component selection), structural design, process planning optimization, product certification.

The semi-contracting model

BQC only helps customers design in one or several of the following areas: software, hardware, structure, component selection or replacement, DFM, process planning and optimization, process automation, and automated test equipment design.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

The implementation of sustainable development strategy allows us to have more time and energy to realize the research and development of new Medical Instruments Equipments PCBA Electronics Components Assembly D. Our company advocates the human resource development concept of 'training excellent technical team in hard production and development, gathering first-class business elites in fierce market competition'. We welcome new and aged buyers from all walks of lifetime to make contact with us for potential small business associations and mutual success!