Low Volume High Mix PCBA Assembly for Mobile Electronic, Quick Turnaround EMS & ODM Available

Our company actively advocates the concept of 'reputation first, quality first', with high-quality One Stop Electronic Pcba Assembly, Smt PCB Assembly, PCB Quick-Turn Prototype LED Panel, first-class service, moderate price advantage, fully win the love of the market and customers. Our products have been exported to many countries. We have won high praise from customers at home and abroad and established an honest and trustworthy enterprise image. We continually hope to innovate and improve our service marketing system to serve the company's overall strategy.

Our service scope:

Processing of incoming materials:

SMT patch, DIP plug-in, post welding, test maintenance, assembly, three-proof paint spray, 10,000-level dust-free LCD assembly, SMT 4-6 hours fast proofing.

What about our capitity

For OEM:

Printed circuit board manufacturing (PCB manufacturing), procurement of components and related structural parts, accessories, PCBA quick proofing, electronic contract manufacturing, PCBA patch processing (SMT), PCBA through-hole plug-in processing (THT), DIP processing (wire assembly / Structural parts assembly / three anti-paint spray), post-welding, multi-layer high-precision electronic products manufacturing.

ODM:

One, fully contracted

Client: only idea

BQC: Responsible for software development, hardware development (production schematics / PCB LAYOUT / component selection), structural design, process planning optimization, product certification.

The semi-contracting model

BQC only helps customers design in one or several of the following areas: software, hardware, structure, component selection or replacement, DFM, process planning and optimization, process automation, and automated test equipment design.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

We are committed to providing our customers and society at large with Low Volume High Mix PCBA Assembly for Mobile Electronic, Quick Turnaround EMS & ODM Available and services of scale and quality. Our company has always put the interests of customers above our own interests, and has been widely praised. We integrate design, manufacture and export together with more than 100 skillful workers, strict quality controlling system and experienced technology.