EMS/OEM/ODM Electronic Circuit Board Manufacturing PCBA PCB Assembly Plant

Our company adheres to "professional people to do professional things" to provide customers most cost performance Ventilation Control Board PCBA EMS Service, Customer Electronics One Shop Service, Through Hole PCB Board Assembly For Industrial Board and valuable after-sales service. We must not only deeply strengthen the competitiveness of our core products, but also constantly improve the company's talent development and optimization of technological innovation mechanisms. High quality and satisfactory service is the bridge between products and users. No matter in the pre-sale or after-sales stage, our staff will provide technical consultation and service for customers based on the principle of excellence, honesty and trustworthiness, so as to solve the problems encountered by users in a timely manner. We keep seeking truth from facts, and we believe in unity and cooperation, love and dedication.

Our service scope:

Processing of incoming materials:

SMT patch, DIP plug-in, post welding, test maintenance, assembly, three-proof paint spray, 10,000-level dust-free LCD assembly, SMT 4-6 hours fast proofing.

What about our capitity

For OEM:

Printed circuit board manufacturing (PCB manufacturing), procurement of components and related structural parts, accessories, PCBA quick proofing, electronic contract manufacturing, PCBA patch processing (SMT), PCBA through-hole plug-in processing (THT), DIP processing (wire assembly / Structural parts assembly / three anti-paint spray), post-welding, multi-layer high-precision electronic products manufacturing.

ODM:

One, fully contracted

Client: only idea

BQC: Responsible for software development, hardware development (production schematics / PCB LAYOUT / component selection), structural design, process planning optimization, product certification.

The semi-contracting model

BQC only helps customers design in one or several of the following areas: software, hardware, structure, component selection or replacement, DFM, process planning and optimization, process automation, and automated test equipment design.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

 From processing ability of manufacturing

  Our machine can mount  the minimal components package size is 01005.

    We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.

    We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.

We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

We have a mature process and modern management mode, and are committed to the development of EMS/OEM/ODM Electronic Circuit Board Manufacturing PCBA PCB Assembly Plant market. We continue to improve professional services to meet various needs of customers. Our good reputation and perfect craftsmanship have earned us wide social acclaim and given us great momentum for development. Controlling business risk and product quality is one of the important conditions to ensure the healthy development of our company.