With the development of the times, we provide customers with updated business opportunities with cheap and high-quality Pcba Telecommunication Products, Service Pcba, EMS PCBA Assembly For 16 Years. Our company has the ability to solve customer problems, and our enthusiastic service standards are well-known in the industry. Our company takes customer profit as the responsibility, which makes the company more and more favored by customers at home and abroad. Our company through the expansion of production scale, reduce product costs, strengthen bargaining power.
Our service scope:
Processing of incoming materials:
SMT patch, DIP plug-in, post welding, test maintenance, assembly, three-proof paint spray, 10,000-level dust-free LCD assembly, SMT 4-6 hours fast proofing.
What about our capitity
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For OEM:
Printed circuit board manufacturing (PCB manufacturing), procurement of components and related structural parts, accessories, PCBA quick proofing, electronic contract manufacturing, PCBA patch processing (SMT), PCBA through-hole plug-in processing (THT), DIP processing (wire assembly / Structural parts assembly / three anti-paint spray), post-welding, multi-layer high-precision electronic products manufacturing.
ODM:
One, fully contracted
Client: only idea
BQC: Responsible for software development, hardware development (production schematics / PCB LAYOUT / component selection), structural design, process planning optimization, product certification.
The semi-contracting model
BQC only helps customers design in one or several of the following areas: software, hardware, structure, component selection or replacement, DFM, process planning and optimization, process automation, and automated test equipment design.
From processing ability of manufacturing
Our machine can mount the minimal components package size is 01005.
We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.
We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.
We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

From processing ability of manufacturing
Our machine can mount the minimal components package size is 01005.
We often do double-row QFN, such as Qualcomm (Atheros) AR9341 (which is characterized by no pins, pad spacing 0.4MM, we can control the production fraction defective to 0.1%). Please see attached picture.
We often do double-layer BGA (ball pitch 0.4MM), please see attached picture.
We often do LGA products ( the pad spacing is large, thus it is prone to bubbles), and WIFI module, 4G module.

Our service attitude of 'customer benefit first' is that, we can think from the perspective of customers in every production and research and activities, and provide customers with China EMS One Stop PCB/PCBA/Components Assembly that are more in line with customer interests from a professional perspective. The company can achieve today's scale, improving product quality is the key, but to improve product quality, we have to first improve staff quality. The core concepts and values of our company are the common beliefs of all our employees, which control their behaviors.
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