FAQ
Q： For ODM service, if you can provide software design?
A: Yes, we can provide not only the software design, but also the firmware design.
Q： What’s your L/T for PCBAs?
A: Ample is 4W,for mass order, the materials generally need 8W, and the production needs 4W. Materials that are longer than 8W we can stocked for customers. Most of the materials we can stocking for customers for free, but we need to confirm if the materials are special and only used by your company that other customers can not use them, which need your to pay the deposit.
How to do a heat resistance test for PCB boards
In order to ensure the quality of PCB circuit boards, the need for temperature resistance testing, the purpose is to prevent the PCB in too high a temperature burst board, blistering, delamination and other adverse reactions, resulting in poor product quality or outright scrap. PCB temperature issues with raw materials, solder paste, surface parts to withstand the temperature, usually PCB circuit board up to 300 degrees, 5-10 seconds; over the lead-free wave soldering when the approximate temperature is 260, over the lead is about 240 degrees.
So how do PCB heat resistance test it?
1, prepare PCB sample boards, tin furnace.
Sample 10 * 10cm substrate (or laminate, finished board) 5pcs (including copper substrate without blistering and delamination)
Substrate: 10cycle or more
Laminate: LOWCTE15010cycle or more
HTg material: 10 cycles or more
Normal material: more than 5 cycles
Finished board: LOWCTE1505cycle or above; HTg material 5cycle or above; Normal material 3cycle or above.
2、Set the temperature of the tin furnace to 288±5 degrees, and use contact temperature measurement calibration.
3, first use a soft brush to dip flux, coated to the board surface; then use crucible pliers cheek to take the test board immersed in the tin furnace, timing 10sec after taking out to cool to room temperature, visual inspection of whether there is blistering burst board, this is 1cycle;.
4, if the visual inspection found that there is blistering burst board problems, immediately stop the tin dip analysis of the burst point f / m; if there is no problem, and then continue to cycle until the burst board, to 20 times as the end;.
5, the blister needs to be sliced and analyzed to understand the source of the burst point, and take pictures.
The above is about the temperature of the PCB circuit board content, for different materials of the PCB circuit board temperature is how much, need to be understood in detail, not to exceed its maximum limit temperature, so as to avoid the PCB circuit board scrap problem.
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