PCB assembly Capacity:
- Min component: 03015,01005
- Min BGA pitch: 0.6mm
- Lead Free Soldering
- BGA soldering
- Supply Resistor: 0201 0402 0603 0805 series
- Supply Capacitor: 0201 0402 0603 0805 series
BQC factory environment
FAQ
Q1: What does your company do for product testing?
A1:We have SPI+AOI and X-Ray and ICT as well as FCT testing.
Q2: What are the advantages of your company's OEM service?
A2:Our product costs are gradually reduced and our project are increasingly optimized.
Company Knowledge
PCBA is manufactured considering the specific content of thermal design
Some problems should be paid attention to when designing PCBA, such as PCBA assembly process design, component layout design, assembly process design, automatic production line veneer transmission and positioning element design.
1. Automatic production line board transmission and positioning elements design, automatic production line assembly, PCB must have the ability to transmit edge and optical positioning symbols, which is the prerequisite for production.
2.PCBA assembly process design, PCBA assembly process design, that is, components on the front and back of the PCB components layout structure. It determines the process PCB plant method and path for assembly, so it is also called process path design.
3. Component layout design, namely, the position, direction and spacing design of components on the assembly surface. The layout of components depends on the welding method used. Each welding method has specific requirements on the placement position, direction and spacing of components. Therefore, this book introduces the layout design requirements according to the welding process used in packaging. It should be pointed out that sometimes two or more welding processes are used for an assembly surface, such as "reflow welding 10 wave welding", for such cases, PCBA layout should be designed according to the welding process used for each package.
4. Assembly process design, assembly process design, design for welding rty (namely, through the welding plate, resistance welding and the matching design of stencil, solder paste quantitative, the stability of the fixed point distribution, through the design of the layout, to achieve a single synchronous melting and solidification, encapsulate all welds by installing hole reasonable wiring design, achieve 75% tin penetration rate, etc., These e design goals are ultimately to improve the yield of welding.
There are many contents of PCBA thermal design, and the specific requirements of each PCB board content will have some differences. For example, if there is less tin in the thermal design of the heat sink pad, we can use some methods to solve the problem. The most common one is to increase the heat dissipation hole. So we don't have to panic when we encounter some problems, find some professional people can solve all our problems.
(1) Thermal design of heat sink pad. In the welding of heat sink elements, tin loss on the heat sink pad is encountered, which is a typical application that can be improved by heat sink design.
For the above situation, chip factory can adopt the method of increasing the heat capacity of the cooling hole to design. Connect the heat dissipation hole with the inner ground layer, if the ground layer is less than 6 layers. Part of the signal layer can be isolated as a heat dissipation layer while reducing the aperture to the minimum available aperture size.
(2) thermal design of high-power grounding jack.
In some special product designs, plug holes are sometimes required to be connected to multiple ground/level surfaces. Because the contact time of the soldering pin and tin wave is very short, often for 2~3s, if the heat capacity of the jack is relatively large, the temperature of the lead may not meet the requirements of welding, the formation of cold -welding point.
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