BQC factory environment
FAQ
Q1: What does your company do for product testing?
A1:We have SPI+AOI and X-Ray and ICT as well as FCT testing.
Q2: What are the advantages of your company's OEM service?
A2:Our product costs are gradually reduced and our project are increasingly optimized.
Precautions for SMT chip flow welding
Flow welding is the key process of SMT chip processing. Various accidents may be encountered in the work. If there is no correct treatment method and necessary measures, serious safety and quality accidents may be caused.
Precautions for SMT patch processing and reflow welding:
1. The SMT chip reflow welding furnace must fully reach the set temperature (green light is on) before welding can be started
2. During the welding process, the temperature change of each temperature zone is often observed, and the change range is ± 1 ℃ (according to the reflow welding furnace).
3. In case of abnormal conditions, the equipment shall be shut down immediately.
4. The size of the base plate shall not be greater than the width of the conveyor belt, otherwise it is prone to board jamming accidents.
5. Before welding, protective measures (shielding) or no reflow welding shall be taken for components that cannot withstand normal welding temperature according to the provisions of patch processing process documents or component packaging instructions. Manual welding or post welding by welding robot shall be adopted.
6. During welding, the conveyor belt shall be strictly prevented from vibration, otherwise it will cause component displacement and solder joint disturbance.
7. Regularly measure the exhaust air volume at the grate outlet of the reflow welding furnace, which directly affects the welding temperature.
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