Products Description
The Smart Agriculture Sensors PCBA is a highly integrated and reliable printed circuit board assembly designed for precision agriculture applications. It serves as the core component of smart agriculture systems, enabling real-time monitoring and data collection of environmental parameters such as soil moisture, temperature, humidity, light intensity, and nutrient levels. This PCBA is built with advanced IoT (Internet of Things) technology, ensuring seamless connectivity and data transmission to cloud platforms or mobile devices. Its compact design, low power consumption, and robust performance make it ideal for modern farming, greenhouses, and other agricultural environments.
Products Function
1. Multi-Sensor Integration: Smart Agriculture Sensors PCBA supports a wide range of sensors, including soil moisture, temperature, humidity, light intensity, CO2, and nutrient sensors, enabling comprehensive environmental monitoring for precision agriculture.
2. Real-Time Data Monitoring: Collects and transmits real-time data to cloud platforms or mobile apps, allowing farmers to monitor field conditions remotely and make data-driven decisions.
3. Wireless Connectivity: Equipped with advanced communication modules such as LoRa, NB-IoT, Bluetooth, and Wi-Fi, ensuring seamless data transmission even in remote or large-scale farming areas.
4. Low Power Consumption: Designed with energy-efficient components and low-power modes, making it ideal for solar-powered or battery-operated systems in off-grid locations.
5. Durable and Weatherproof: Built with high-quality materials and IP67-rated protection, ensuring reliable performance in harsh outdoor environments, including extreme temperatures, humidity, and dust.
Products Show
The application of smart agricultural sensor PCBA can be summarized as: achieving precision agricultural management through real-time monitoring of environmental parameters, improving crop yields and resource utilization efficiency.


About BQC
Established in 2003, BQC is a leading provider of comprehensive electronic manufacturing services, backed by 22 years of industry expertise and a dedicated team of 736 employees. We specialize in custom-designed, fully automatic programming and testing equipment, alongside robust PCBA manufacturing, shell assembly, mold opening, and rigorous testing processes. Holding IATF16949, ISO13485, ISO9001, and ISO14001 certifications, we are committed to delivering the highest quality standards. Our unique strength lies in our ability to optimize core device selection and offer pin/function-compatible substitutions, resulting in a remarkable 30% cost reduction and shortened lead times. As a priority distributor for major manufacturers like ST, NXP, ADI, TI, and Microchip, we ensure reliable component sourcing. To support our global clients, we operate state-of-the-art facilities: a 15,000 sq. m. factory in Shenzhen with 22 SMT lines and extensive capabilities, and our strategically located 6,000 sq. m. Malaysian factory, BQC TECH, which offers significant tariff savings of up to 35% amidst rising US tariffs on China, alongside rapid expansion potential.

Our capacity
|
PCB Item |
Production Capacity |
|
Layer Counts |
1--20L |
|
Base Material |
FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) |
|
Material Thickness(mm) |
0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 |
|
Max board size(mm) |
1200x400mm |
|
Board Outline Tolerance |
±0.15mm |
|
Board Thickness |
0.4mm--3.2mm |
|
Thickness Tolerance |
±8% |
|
Minimum line/space |
0.1mm |
|
SMD Pitch |
0.3mm |
|
Min Hole Size(mechanical) |
0.2mm |
|
Min Hole Size(laser hole) |
0.1mm |
|
Hole Size Tol (+/-) |
PTH:±0.075mm;NPTH: ±0.05mm |
|
Surface Finish |
HAL,ENIG,Plated Gold,Immersion Gold,OSP |
|
Copper Weight |
0.5--6oz |
|
Solder mask |
Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
|
Acceptable File Format |
Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 |
|
Certificate |
ROSH,ISO9001,ISO13485,ISO16949,ISO14001,UL |
Certificate



FAQ
1. What are the key steps in the PCBA manufacturing process?
The PCBA process typically includes solder paste application, component placement, reflow soldering (for SMD), wave soldering (for THT), inspection (AOI, X-ray, ICT), and functional testing (FCT) to ensure quality and reliability.
2. How do you ensure the quality of PCBA?
Quality is ensured through rigorous testing methods such as Automated Optical Inspection (AOI), X-ray inspection, In-Circuit Testing (ICT), and Functional Circuit Testing (FCT). Additionally, we adhere to international standards like IPC-A-610 and ISO 9001.
3. Can PCBA be customized for specific applications?
Yes, PCBA can be fully customized in terms of size, layer count, component selection, and functionality to meet the specific requirements of different applications, such as consumer electronics, automotive, medical devices, and industrial equipment.
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