PCB Assembly Capality
| |||
Type of Asssembly | • THD & SMT • Conformal Coating • Wave Soldering and Reflow Soldering | ||
PCB Type | • High TG • Buried and blind holes • Single and Multilayer • Flexible | ||
Components | • Passives parts, smallest size 0201 • Fine Pitch, BGA, QFN • IC Programming • Maximum Component Height = 0.787” | ||
Design file format | • Gerber, .pcb • Bom List (.xls, .csv, . xlsx) • Centroid (Pick-N-Place/XY file) | ||
Testing | • AOI (Automated Optical Inspection) • X-ray Inspection • Functional testing • ICT (In-circuit testing) • Visual Inspection | ||
| Solder Type | • Lead-free / RoHS compliant | ||
Procurement | • Full BOM | ||
The view of our Factory


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