Shenzhen Baiqiancheng Electronic Co.,Ltd
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Liquid Cooling Control Board

Liquid Cooling Control Board

The Liquid Cooling Control Board is developed for thermal management systems where conventional air cooling cannot efficiently handle high heat loads. It coordinates coolant circulation, temperature sensing, pump operation, and valve control, making it suitable for battery energy storage, data center liquid cooling, EV thermal systems, and high-power electronic equipment.

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  • Description

    Liquid Cooling Control Board

    Product Features

     

    Coolant Circulation Control
    The Liquid Cooling Control Board regulates pump speed and coolant flow according to real-time thermal demand, helping maintain proper circulation throughout the cooling loop.

     

    Multi-Point Temperature Sensing
    Receives temperature signals from cold plates, coolant inlet and outlet points, battery modules, or other heat-generating areas for more accurate thermal control.

     

    Pump and Valve Coordination
    Controls pumps, solenoid valves, and related actuators to direct coolant where it is needed and maintain efficient heat transfer.

     

    Leak and Flow Monitoring
    Can work with flow, pressure, and leak sensors to identify insufficient circulation or coolant leakage before it affects system operation.

    PCBA Display

     

    Facial Recognition Terminal PCBA  Electrostatic Sprayer PCBA  Diagnostic Equipment Control Board

    Product Advantages

     

    Better Heat Removal for High-Power Systems
    Liquid cooling transfers heat more efficiently than conventional air cooling, making the board suitable for equipment with concentrated or continuously changing thermal loads.

     

    More Precise Temperature Balance
    The Liquid Cooling Control Board can manage coolant distribution based on temperatures from different zones, reducing hot spots and temperature differences.

     

    Lower Cooling Power Consumption
    Variable-speed pump control allows cooling output to follow actual heat generation instead of operating continuously at maximum capacity.

     

    Compact Thermal Architecture
    Liquid cooling enables effective heat removal within densely packed equipment where airflow and installation space are limited.

    Manufacturing Process

     

    Production includes PCB fabrication, SMT assembly, connector and power-device mounting, firmware loading, and coolant-control interface verification. Pump outputs, temperature inputs, valve channels, flow-sensor signals, and communication ports are checked individually. Functional testing can also simulate different temperature and flow conditions to verify control response.

    Certifications

     

    product-750-597

    Services

     

    We support Liquid Cooling Control Board projects from engineering samples through volume PCBA production. Services can include DFM review, component sourcing, firmware programming, pump and sensor interface adaptation, functional test fixture development, conformal coating, and customized testing based on the customer's cooling-loop design.

    FAQ

     

    Q: What applications are suitable for a Liquid Cooling Control Board?
    A: Typical applications include battery energy storage systems, liquid-cooled data center equipment, EV battery packs, charging systems, power electronics, and industrial computing equipment.

     

    Q: Can it control more than one pump or cooling loop?
    A: Yes. The number of pump, valve, and sensor channels can be designed around single-loop or multi-loop cooling architectures.

     

    Q: Can flow and coolant pressure be monitored?
    A: Yes. Flow meters and pressure sensors can be connected when these functions are required by the thermal system.

     

    Q: Does it support coolant leak detection?
    A: Leak detection inputs can be incorporated to identify abnormal coolant conditions and trigger alarms or protective actions.

     

    Q: Can the board communicate with a BMS or main controller?
    A: Yes. CAN, RS485, UART, or other interfaces can be implemented to exchange temperature, pump status, fault, and operating data with the host system.

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