Our processing/manufacturing ability:
Our SMT machine can mount the minimal components package 01005.
We often mount double-row QFN, such as Qualcomm/Atheros AR9341 (which is characterized by no pins, pad spacing 0.4MM).
We are able to control the production fraction defective within 0.1%.
We often do double-layer BGA (ball pitch 0.4MM)
We often do LGA mounting (Whose pad spacing is large and it is prone to bubbles), WIFI module and 4G module etc.
FAQ
Our Equipments
We provide OEM ODM and DFM for both electronics PCBA and mechanics.
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