BQC factory environment
FAQ
Q1: What does your company do for product testing?
A1:We have SPI+AOI and X-Ray and ICT as well as FCT testing.
Q2: What are the advantages of your company's OEM service?
A2:Our product costs are gradually reduced and our project are increasingly optimized.
Company Knowledge
What effect will the PCB parsing of the circuit board have on the material during processing?
The stability of the multi-layer PCB material standard is the primary factor affecting the positioning accuracy of the inner layer. It is also necessary to consider the influence of the thermal expansion coefficient of the substrate and the copper foil on the inner layer of the multilayer PCB. From the analysis of the physical properties of the substrates used, the laminates all contain polymers whose primary structure will change at a certain temperature, commonly known as the glass transition temperature Tg. Glass transition temperature is a unique function of large number of polymers, second only to thermal expansion coefficient, it is the most important property of laminates.
Plated through holes have a lower natural expansion rate than the surrounding laminate. Since the thermal expansion of the laminate is faster than that of the hole body during the processing of the circuit board, this means that the through hole body is stretched along the deformation direction of the laminate. This stress condition produces a tensile stress in the through-hole body. When the temperature increases, the tensile stress will continue to increase. When the stress exceeds the cracking strength of the through-hole plating, the plating will crack. At the same time, the higher thermal expansion rate of the laminate significantly increases the stress on the inner layer wires and pads, causing the wires and pads to crack, forming a short circuit in the inner layer of the multi-layer PCB.
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