1. Five major development trends
Vigorously develop high-density interconnect technology (HDI) ─hdi embodies the most advanced technology of modern pcb, it brings fine wire to pcb, micro-aperture.
Embedded technology with strong vitality-component embedding technology is a great change of PCB functional integrated circuit, PCB manufacturers should increase the resources input in the system including design, equipment, testing and simulation to maintain strong Vitality.
PCB materials conforming to international standards-high heat resistance, High glass transition temperature (Tg), small thermal expansion coefficient and small dielectric constant. The bright future of the photoelectric PCB-it uses the optical path layer and the circuit layer transmits the signal, this new technology key is manufactures the optical path layer (the optical waveguide layer).
is an organic polymer, using lithography, laser ablation, reaction ion etching and other methods to Form.
Update manufacturing process, introduce advanced production Equipment.
2. Transfer to non-halogenated
With the improvement of global environmental awareness, energy saving and emission reduction has become the urgent matter for national and Enterprise Development.
As a high pollutant emission rate of the PCB enterprises, should be more energy-saving and emission reduction work of important respondents and participants.
Developing microwave technology to reduce the use of solvents and energy in the manufacture of PCB prepreg embryos
Research and development of new resin systems, such as water-based epoxy materials, to reduce the hazards of solvents; extracting resins from renewable sources such as plants or microorganisms to reduce the use of oil-based resins
Search for materials that can replace leaded solder
Development of new, reusable sealing materials to ensure that devices and packages are recyclable and removable
3. Long-term manufacturers should put resources to improve
PCB precision-reduce PCB size, width and space track
PCB durability-in line with international standards
High-performance PCB-reduced impedance and improved blind hole technology
Advanced production equipment-in japan, the United states, Taiwan and Europe production equipment such as automatic plating line, gold-plated wire, Mechanical and laser drilling machine, large platen machine, automatic optical inspection, laser plotter and line test equipment, etc.
Quality of human resources-including technical and managerial personnel Environmental pollution treatment-meet The requirements of environmental protection and sustainable development
