Recently, BQC has commissioned the FAI-JCX860 SMT intelligent first article inspector, further strengthening our front-end quality verification capability for high-reliability PCBA manufacturing.
The FAI system automates first article validation for SMT assemblies. It performs rapid measurement and cross-comparison against Gerber and BOM data, checking component reference designators, package specifications, polarity, pad connections and dimensional parameters. Replacing the time-consuming manual first article checking workflow, this equipment cuts first article review time and reduces human errors during new product introduction (NPI). This quality checkpoint perfectly fits our SST, SiC and power electronics PCBA projects, ensuring the very first production panel fully complies with design specifications before mass production starts.
By upgrading NPI incoming verification, BQC minimizes early-stage manufacturing deviations and lowers rework risks for high-reliability orders. This investment complements our existing test and process equipment portfolio, delivering more stable quality assurance for global power electronics clients.
