BQC has expanded its automated press-fit capabilities to support high-volume, high-precision assembly of SiC power modules and high-current connectors, addressing key challenges in SST and power electronics manufacturing.
By bringing the press-fit process upstream into standard PCBA production flow, BQC eliminates extra secondary processing required at the customer's side. This effectively reduces rework damage risk, simplifies the overall supply chain arrangement, and shortens assembly lead times for high-power product designs.
The in-house Zhizhan CT-1050L automated press-fit system supports multi-point pressing for large-size PCBs up to 600 × 450 mm. It adopts programmable force control up to 30,000 N together with real-time force and position monitoring throughout production.
The whole process ensures stable and consistent assembly quality in mass production, delivering highly integrated and production-ready modules that fully meet mechanical structure and electrical stability requirements of high-voltage SST and power electronic applications.
