Occasionally, PCBA boards undergo repair, which is also a very important process. Once minor errors occur, it may directly lead to the circuit board being scrapped and unusable.
1, Baking requirements
All new components to be installed must undergo baking and dehumidification treatment in accordance with the relevant requirements of the "Specification for the Use of Moisture Sensitive Components" based on the moisture sensitivity level and storage conditions of the components.
If the repair process requires heating to above 110 ℃, or if there are other moisture sensitive components within 5mm of the repair area, it must be baked and dehumidified according to the relevant requirements in the "Specification for the Use of Moisture Sensitive Components" based on the moisture sensitivity level and storage conditions of the components.
For moisture sensitive components that need to be reused after repair, if repair processes such as hot air reflux, infrared, etc. are used to heat solder joints through the component packaging, they must be baked and dehumidified according to the relevant requirements in the "Specification for the Use of Moisture Sensitive Components" based on the moisture sensitivity level and storage conditions of the components. For the repair process using manual chrome iron heating solder joints, pre baking treatment is not required as long as the heating process is controlled.
2, Requirements for storage environment after baking
After baking, moisture sensitive components, PCBA, and unpacked new components to be replaced need to be re baked once the storage conditions exceed the deadline.
3, Requirements for PCBA repair heating frequency
The cumulative repair and heating allowed for components shall not exceed 4 times; The allowed number of repairs and heating for new components shall not exceed 5 times; The allowed number of times for repairing and heating the reused components that have been removed shall not exceed 3.
