What is the difference between SPI and AOI in SMT process?
The main difference between SPI and AOI in the SMT process is: SPI is the quality inspection of solder printing, and the debugging, verification and control of the solder paste printing process through inspection data; and AOI is divided into two types: before the furnace and after the furnace, the former is for the device. The placement is tested, the stability of the placement is tested before the furnace, the latter is tested on the solder joints, and the welding quality is tested after the furnace.
SPI (solder paste inspection, also known as solder paste inspection) is the quality inspection of solder printing and the debugging, verification and control of the printing process. Its basic function is to discover the defects of printing quality in time. SPI can intuitively tell users which solder pastes are good and which are bad, and provide hints for defect types. Through the inspection of a series of solder joints, the trend of quality change is found. SPI is to detect quality trends through a series of solder paste inspections, and to find out the potential factors causing this trend before the quality exceeds the range, such as the control parameters of the printing machine, human factors, solder paste change factors, etc. Then adjust in time to control the continued spread of the trend.
Baiqiancheng has been in the PCBA industry for more than 18 years, and has been focusing on the control of the production process, strictly controlling each link of production, and ensuring that the test is correct before shipping to customers. Baiqiancheng pays great attention to the quality of PCBA production. Introduce professional production equipment such as SPI solder paste tester and AOI test equipment to ensure the quality of PCBA.
