1. The surface of the soldering area is polluted, the surface of the soldering area is stained with flux, or a metal compound is formed on the surface of the chip component. will cause poor wetting. For example, sulfide on the surface of silver and oxides on the surface of tin will cause poor wetting.
2. When the residual metal in the solder exceeds 0.005%, the activity of the flux will decrease, and poor wetting will also occur.
3. During wave soldering, there is gas on the surface of the substrate, which is also prone to poor wetting.
Regarding the above, BQC believes that strictly implementing the corresponding soldering process, cleaning the surface of the PCB board and components, selecting the appropriate solder, and setting a reasonable soldering temperature and time are powerful solutions.
