In PCBA processing, when the surface tension of solder is destroyed, it will cause poor soldering of surface mount components. The main manifestation of poor wetting is that during the soldering process, there is no reaction between the substrate pad and the metal after the solder is infiltrated, resulting in less soldering or missing soldering.
BQC will strictly control the quality during processing, strictly prevent quality problems, and will find out and actively solve problems in time.
