What are the factors that affect PCBA penetration
What are the factors that affect PCBA penetration? The PCBA penetration requirements of through-hole solder joints are generally more than 75%, and PCBA penetration is suitable at 75% to 100%. Usually materials, wave soldering Process, flux, manual soldering and other factors will have a certain impact on PCBA penetration.
1. Materials
The tin melted at high temperature has strong permeability, but it is difficult to penetrate into the metal like aluminum. If the metal to be welded has an oxide layer, we usually treat it with flux or brush it with gauze.
2. Flux
Flux mainly plays the role of removing the surface oxides of PCB and components and preventing re-oxidation during the welding process. Poor selection of flux, uneven coating, and too little amount will lead to poor penetration of tin, and it is necessary to replace damaged ones in time. Use the nozzle to ensure that an appropriate amount of flux is applied to the surface of the PCB board to exert the fluxing effect of the flux.
3. Manual welding
In the actual plug-in welding quality inspection, a considerable part of the weldment only formed a cone on the surface of the solder, but no tin penetrated into the via hole. In the functional test, it was confirmed that many of these parts were false welding, which is mostly caused by manual plug-ins. In welding, the reason is that the temperature of the soldering iron is not appropriate and the welding time is too short.
Fourth, wave soldering
The wave soldering process will directly affect the PCBA tin penetration problem, and re-optimize the welding parameters with poor tin penetration, such as wave height, temperature, welding time or moving speed.
Shenzhen Baiqiancheng Electronics Co., Ltd. has 19 years of PCB processing experience and rich experience in quality management in the production process. We strictly follow the production standard of 75% DIP through-hole tin, strictly control the product quality, and gain a good reputation in this field.
