Prevent PCBA Pad Oxidation to Boost Reliability
In the field of electronics manufacturing, PCBA (Printed Circuit Board Assembly) pad oxidation is a "silent killer" that impacts product yield and long-term reliability. Oxidation directly leads to a decrease in pad solder ability, causing critical defects such as cold joints and insufficient soldering. Therefore, effectively preventing pad oxidation is a crucial step in ensuring product quality.
Root Causes of Oxidation and Core Prevention Strategies
Pad oxidation is primarily caused by environmental factors such as humidity, sulfides, and halides. The core of prevention lies in establishing a clean and dry protection system that covers the entire process from production, storage, to transportation.
Key Points for Full-Process Protection
Production Stage: Selecting the appropriate surface finish is vital. Processes like OSP (Oxidation Resistance Treatment), ENIG (Electroless Nickel Immersion Gold), and immersion silver can form a protective layer to isolate the pads from air. The production environment must have strictly controlled temperature and humidity.
Storage Stage: This is the most critical phase for preventing oxidation. It is essential to use vacuum packaging along with desiccants and humidity indicator cards. The ideal storage environment is a nitrogen cabinet or a constant temperature/humidity storage cabinet, which fundamentally isolates the boards from moisture and oxygen.
Transportation and Usage: PCBA boards should be soldered as soon as possible after opening the packaging (typically within 24-72 hours, depending on the surface finish such as OSP). If not used immediately, they must be re-sealed under vacuum.
In summary, by establishing a full-process "isolation protection" mindset from raw materials to finished products, and strictly implementing standardized storage procedures, companies can significantly improve product yield and long-term reliability, thereby gaining market trust.
