PCBA RoHS Process Control Specification
1. Control of warehouse management
1) All incoming materials are inspected by IQC
2. Requirements for process accessories in PCBA processing plants
1) All process accessories used in RoHS products are required to comply with RoIS requirements and have relevant RoHS test qualification reports.
2) All lead-free solders (solder paste for reflow soldering, solder paste for wave soldering, solder wire for manual soldering, solder balls for BGA rework, etc.) need to choose Sn-Ag-Cu alloy solder
3. SMT RoHS process control points:
The peak temperature of the reflow zone of the lead-free soldering process reflow furnace is not greater than 250"C, not lower than 230"C: under the temperature condition above 217"C, the reflow holding time is less than 40 seconds and less than 90S;
4. Control requirements for wave soldering RoHS process
(1) Transmission speed: 0.7~1.2m/min;
(2) Preheating temperature: Preheating temperature refers to the temperature reached before the PCB contacts the wave crest surface: Preheating temperature: 110C~150C
(3) Welding temperature: Welding temperature is a very important welding parameter, usually 50'C ~ 60C higher than the melting point of the solder. , which is the result of heat absorption by the PCB. Tin wave temperature: 260C~270C. Soldering time: 3~5sec, each single board can only be soldered by wave soldering once.
(4) The wave soldering process needs to control the control of flux spraying and the control of wave height during soldering.
Shenzhen Baiqiancheng Electronics Co., Ltd. has operated its own factory for more than 19 years. It strictly controls the PCBA processing technology in accordance with ROHS standards, meets the high requirements and high standards for PCBA quality over the years, and provides customers with high-quality PCBA.
