Packaging of components
The packaging method of SMT chip components is a very important link in the entire SMT chip processing, which directly affects the production efficiency of the entire chip processing line. There are four main packaging forms of components, Tape and Reel, tube packaging, tray packaging and bulk.
1. Tape packaging
Tape and Reel is a packaging form with the most extensive application, longest application time, strong adaptability and high chip processing efficiency, and has been standardized. Except for large-scale components such as QFP, PLCC, and BGA, other SMT components can use this packaging form. The tapes used mainly include paper tapes, plastic tapes and adhesive tapes.
2. Tube packaging
Tube packaging is mainly used for packaging rectangular, chip components, small SMD and some special-shaped components, such as SOP, SOJ, PLCC and other integrated circuits, suitable for products with many varieties and small batches.
3. Pallet packaging
Tray, also known as Waffle, has a single layer, up to 100 layers. Tray packaging is mainly used for the packaging of components with large size or easily damaged pins, such as QFP, narrow-pitch SOP, PLCC, BGA and other integrated circuits.
4. Bulk
Leadless, non-polar surface mount components can be bulk, such as general rectangular, cylindrical capacitors and resistors. Bulk components are low cost, but are not conducive to pick and place by chip processing equipment.
Shenzhen Baiqiancheng Electronics Co., Ltd. has its own professional procurement team. We will purchase the appropriate packaging according to the customer's demand and quantity. We have rich experience in the packaging of components.
