1, baking
Bake PCB and components exposed to air for a long time to prevent moisture.
2. Control of solder paste
Solder paste contains water is also easy to produce pores, tin bead situation. Firstly, the solder paste with good quality should be selected. The return temperature and stirring of the solder paste should be carried out strictly according to the operation. The exposure time of the solder paste in the air should be as short as possible.
3. Workshop humidity control
Monitor the humidity in the workshop in a planned way, controlling 40-60%.
4. Set reasonable furnace temperature curve
The furnace temperature should be tested twice a day to optimize the furnace temperature curve and the heating rate should not be too fast.
5, flux spraying
In the wave soldering, flux spraying amount should not be too much, spraying reasonable.
6. Optimize the furnace temperature curve
The temperature of the preheating zone should meet the requirements, not too low, so that the flux can fully volatilize, and the speed of the furnace should not be too fast.
