1. Cleaning Process: Removing Manufacturing Residues
During soldering processes such as SMT and THT assembly, residues such as flux, solder paste particles, dust, and other contaminants may remain on PCB surfaces.
Water-based cleaning agents work by penetrating and dissolving these residues, helping separate contaminants from PCB surfaces and component areas.
The cleaning process may include:
• Chemical reaction with residues;
• Removal of water-soluble flux and contaminants;
• Mechanical action through spraying or agitation.
This helps improve PCB surface cleanliness and reduces potential reliability risks caused by residue accumulation.
2. Rinsing Process: Eliminating Remaining Contaminants
After cleaning, PCB assemblies require thorough rinsing to remove remaining cleaning agents and dissolved residues.
A controlled rinsing process helps prevent:
• Chemical residue remaining on PCB surfaces;
• Potential corrosion risks;
• Electrical performance issues caused by contamination.
High-quality water control and rinsing parameters are important factors in achieving consistent cleaning results.
3. Drying Process: Ensuring Product Reliability
After rinsing, PCB assemblies must be completely dried to remove moisture from surfaces, component gaps, and hard-to-reach areas.
Effective drying helps prevent:
• Moisture-related failures;
• Insulation problems;
• Long-term reliability issues.
Proper drying processes are especially important for high-reliability electronic applications.
