The development trend of electronic information industry has higher and higher requirements for the assembly process of PCBA, and the reliability and quality of complete electronic products mainly depend on the reliability and quality level of PCBA. In the process practice and failure analysis of PCBA, BQC found that the residues on PCBA have a great impact on the reliability level of PCBA.
The residues on PCBA mainly come from the assembly process, especially the welding process. Such as the flux residues used, the reaction by-products between flux and solder, adhesives, lubricating oil and other residues. The potential hazards of other sources are relatively small, such as pollutants and sweat stains caused by the production and transportation of components and PCB itself.
