BQC has completed installation and full commissioning of its new vacuum potting dispensing machine, strengthening high‑reliability encapsulation capability for power modules, energy‑storage BMS and SST‑related PCBA assemblies.
Operating under vacuum environment, this equipment effectively eliminates air bubbles during epoxy and silicone potting. It ensures complete resin penetration into narrow gaps of power electronic components, avoiding void‑caused insulation failure. Featuring accurate two‑component glue metering, servo motion control and touch‑screen parameter configuration, the unit delivers stable and repeatable potting results for mass production.
Supported by our IATF16949, ISO9001 & ISO13485 certified manufacturing system, the vacuum potting machine complements our existing selective soldering, press‑fit, water‑base cleaning and flash measuring equipment. It forms a more complete process chain for SiC / IGBT modules and energy‑storage products. Global customers for power electronics and energy storage can assess our upgraded encapsulation capacity to accelerate project validation and order conversion.
