Working principle of the patch machine: The components are sucked by the nozzle, and the position deviation is corrected in real time with the on-the-fly technology, with an accuracy of ±15μm.
Solder paste printing: A fully automatic steel screen printer is used to monitor the thickness and area in real time through SPI (solder paste detector) to ensure printing consistency.
Process challenges: Micro components (such as 0201 resistors) are prone to tombstone effects, and pad design and solder paste formula need to be optimized.
In early 2024, ASM Pacific launched a new generation of chip mounters equipped with an AI visual system that can automatically identify component polarity and correct mounting angles, increasing production efficiency by 18%.
