Assembly reliability, also known as process reliability, usually refers to the ability of a PCBA to be soldered without being damaged by normal operations. If it is not properly designed, it is easy to damage or damage the soldered joints or components.
BQC believes that the design of assembly reliability should not be limited to the improvement of the layout of components, but should start from reducing the stress of assembly - using appropriate methods and tools, strengthening the training of internal personnel, and standardizing operation actions, only in this way can the assembly stage be solved. Solder joint failure problem occurs.
