Reasons for PCBA proofing tinning not full may include inappropriate temperature and speed, inappropriate solder viscosity, low-quality solder paste, improper PCB surface treatment and improper commissioning of equipment. In order to solve this problem, you can adjust the parameters of the tinning equipment, select high-quality solder paste, appropriate PCB surface treatment, and regular inspection and maintenance of equipment. This will ensure that the solder can completely wet the pads and pins, to achieve the full effect of the tin.
In order to solve the problem of tinning is not full, BQC believes that the following measures can be taken: Adjust the temperature, speed and other parameters of the soldering equipment to ensure proper solder flow. Use high-quality solder paste to ensure good wetting and flow properties.
