What is the reason for the poor gloss of solder joints in SMT chip processing?
In the SMT welding technology, many customers usually have requirements for the brightness of the solder joints. After all, the brightness of the solder joints will give us a bright feeling. In the process of SMT chip processing, it is not guaranteed that the brightness of each solder point can reach the level of sparkling. So what is the reason for the insufficient gloss of solder joints in SMT chip processing?
BQC believes that there are the following reasons: 1. The tin powder in the solder paste has oxidation appearance. 2. The flux itself in the solder paste has additives that form a matting effect. 3. The preheating temperature of reflow soldering is low in SMD processing, and there are residues that are not easy to evaporate on the surface of the solder joints. 4. There is rosin or resin residue on the surface of the solder joint after welding.
