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What is the impact of analyzing the circuit board on the material during PCB processing

Feb 26, 2022

Since Baiqiancheng established, it has always put the needs of customers first, operates with integrity, insists on sharing corporate profits with employees, and with full of gratitude. As we knew, since the 4th quarter of 2020, the material shortage,also lead time extending, price increasing,BQC here is dedicated to supporting customers whose projects were influenced by MCU shortages, such as ST, Microchip, NXP etc. In order to solve the current lead time extending, price increasing, BQC has proposed core device selection and substitute programs to help customers pass the difficult period smoothly.

PCBA 64

The stability of multi-layer PCB material standard is the primary factor affecting the positioning accuracy of the inner layer. It is also necessary to consider the influence of the thermal expansion coefficient of substrate and copper foil on the inner layer of Multilayer PCB. From the analysis of the physical properties of the substrate used, the laminates contain polymers, and its primary structure will change at a certain temperature, which is commonly known as the glass transition temperature Tg. Glass transition temperature is the unique function of large subordinate polymers, second only to the coefficient of thermal expansion. It is the most important characteristic of laminates.

In the process of circuit board processing, the selection of raw materials is also very important. We should conduct in-depth analysis on the functions of raw materials to ensure that the raw materials meet certain skill requirements and bring assistance to later processing. In the future, the skills will continue to develop, and its production method will become more advanced over time to ensure that the standard and accuracy of the circuit board meet the requirements.