There are more and more electronic devices nowadays, and many things are developing towards intelligence. This also requires more circuit boards to undertake the control systems of these devices. There are two processing technologies in PCBA processing factories, which can be selected according to customer needs: lead-free processing technology and lead-based processing technology. The solder used in lead-free technology is not 100% lead-free, but has lower lead elements compared to lead-based solder.
The specific differences between PCBA processing lead-free process and lead-based process are as follows:
In the lead-free processing, due to the characteristics of the solder itself, some auxiliary materials are needed for welding, and the use of lead-free solder paste in reflow soldering increases the cost of using lead-free solder paste by two times. At the same time, the use of tin wires and bars in the wave soldering process also increases the processing cost by at least two times, resulting in a higher cost of lead-free processing;
The melting point temperature of lead-free solder used in the lead-free processing is 217 ℃, while the melting point temperature of lead-based solder is 183 ℃. Because lead-based solder has a lower melting point, it causes less thermal damage to electronic components. After processing, the solder joints are also brighter, harder, and of better quality;
The lead element contained in lead solder poses a significant threat to human health, and long-term exposure has a significant impact on human health. Meanwhile, the widespread use of lead-free processing technology in the international market is also a form of environmental protection, as people have become aware of the increasingly serious environmental pollution problems that pose a threat to them.
In the electronic assembly process or PCBA processing, relevant electronic processing factories can choose their processes based on the above, and cannot pursue the advantages of lead-free processes or reject lead-based processes.
