AOI automatic optical inspection can detect and diagnose the solder paste printing, component mounting and welding conditions of PCBA. Its working principle is based on the optical principle and compares it with the pre-entered parameters of the good product board to detect the bad phenomena on the PCBA. When defects are detected, the relevant defects can also be marked to facilitate subsequent maintenance and processing; AOI can detect defects such as excess tin, less tin, component displacement, component misinstallation, solder balls, empty soldering, etc. Among them, the detection effect of defects in solder paste printing is not very good, and the detection results are not as accurate as SPI detection. After all, the main function of AOI is to detect problems with component placement and welding effects, while SPI is Equipment mainly used to detect solder paste printing problems. This is also the difference between AOI and SPI;
The working principle of x-ray is to detect PCBA welding defects and internal quality problems of electronic components through Defect detection, such as whether there are short circuits in chips and other components, whether there are defects in welding, etc. The difference between AOI and AOI is that AOI is used to detect external defects such as PCBA component placement and poor welding, while x-ray is used to detect Regarding internal defects such as PCBA component quality and welding, to put it simply, AOI detection is used to detect external defects of PCBA, while x-ray is used to detect internal defects of PCBA.
