In recent years, with the continuous development of light, thin, power saving, miniaturization and planarization of electronic information products, it is necessary to use surface mount (SMT) technology for electronic products for different purposes. And tin beads are seriously harmful to electronic products, so how to reduce tin beads is one of the key control contents of SMT enterprises.
In SMT production, during reflow soldering, due to the splashing of solder paste metal particles, it is easy to form tiny spherical solder beads or irregular-shaped solder particles, which are solder beads, which not only affect the appearance of PCB products, but also may cause short circuits during use. It seriously affects the quality and life of electronic products. It is caused by many factors. BQC believes that it is important to study the reasons for its occurrence and to strive for the most effective control.
